The first details about Qualcomm's next premium Snapdragon chipset are arriving

Qualcomm unveiled the Snapdragon 888 chipset in December last year, and now a well-known whistleblower suggests that the company is already heavily testing its next premium SoC. The chipset has the model designation SM8450 and the code name Waipio.

According to the allegations, the new chipset should implement some innovations for cameras, considering that it has a new module for photo and video processing called Leica1.

Announcer Roland Quandt suggests that the platform will be manufactured by Samsung. Also interesting is the partnership with Leica, which has worked with Huawei so far.

 
See also: Details about the Qualcomm Snapdragon 775 chip have surfaced


In addition to this, Quandt mentions that the Qualcomm SM8325 is also in preparation. It is a derivative of the current Snapdragon 888 chip, and the main difference with this model is the lack of an integrated 5G modem.

A third Qualcomm chipset was also spotted, which is already available to test partners. The chip bears the SM7325 model designation and has one powerful @ 2.7GHz core. There are three more cores clocked at 2.4GHz and four cores @ 1.8GHz. It will support up to 16GB of RAM.

Source: GSMArena